Izindaba - Ubuhle nokubi kwesikrini sokubonisa se-LED esihlanganiswe ne-COB kanye nobunzima baso bokuthuthuka

Ubuhle nokubi kwesikrini sokubonisa se-COB esipakishwe nge-LED kanye nobunzima baso bokuthuthuka

Ngokuqhubeka okuqhubekayo kobuchwepheshe bokukhanyisa besimo esiqinile, ubuchwepheshe bokupakisha be-COB (chip on board) buye bathola ukunakwa okwengeziwe.Njengoba umthombo wokukhanya we-COB unezici zokumelana nokushisa okuphansi, ukuminyana okuphezulu kokukhanya okukhanyayo, ukukhanya okuncane, nokuphuma okufanayo, sekusetshenziswe kabanzi ekukhanyeni kwangaphakathi nangaphandle, njengesibani esiphansi, isibani se-bulb, ishubhu le-fluorescent, isibani somgwaqo, kanye nesibani sezimboni nesezimayini.

Leli phepha lichaza izinzuzo zokupakishwa kwe-COB uma kuqhathaniswa nokupakishwa kwe-LED yendabuko, ikakhulukazi ezicini eziyisithupha: izinzuzo zethiyori, izinzuzo zokukhiqiza, izinzuzo eziphansi zokumelana nokushisa, izinzuzo zekhwalithi yokukhanya, izinzuzo zohlelo lokusebenza, nezinzuzo zezindleko, futhi lichaza izinkinga zamanje zobuchwepheshe be-COB. .

Umehluko phakathi kokufakwa kwe-COB nokupakishwa kwe-SMD

Izinzuzo zethiyori ze-COB:

1. Ukuklama nokuthuthukiswa: ngaphandle kobubanzi bomzimba owodwa wesibani, kungaba kuncane ngombono;

2. Inqubo yezobuchwepheshe: nciphisa izindleko zebakaki, wenze lula inqubo yokukhiqiza, unciphise ukumelana nokushisa kwe-chip, futhi uzuze ukupakishwa okuphezulu;

3. Ukufakwa kobunjiniyela: Ngasohlangothini lohlelo lokusebenza, imojuli yokubonisa ye-COB LED inganikeza ukusebenza kahle kakhulu nokushesha kokufaka kubakhiqizi bohlangothi lwesicelo sokubonisa.

4. Izici zomkhiqizo:

(1) I-Ultra ukukhanya nokuncane: Amabhodi e-PCB anogqinsi olusukela ku-0.4-1.2mm angasetshenziswa ngokuvumelana nezidingo zangempela zamakhasimende ukunciphisa isisindo okungenani sibe yi-1/3 yemikhiqizo yasekuqaleni yendabuko, enganciphisa kakhulu isakhiwo. , izindleko zokuhamba nezobunjiniyela zamakhasimende.

(2) Ukumelana nokushayisana nokumelana nokucindezelwa: Imikhiqizo ye-COB ihlanganisa ngokuqondile ama-chips e-LED ezindaweni eziyisibani eziqondile zamabhodi e-PCB, bese iwahlanganisa futhi iwaqinise nge-epoxy resin adhesive.Ingaphezulu lamaphoyinti wesibani liphakanyiswe libe yindilinga, elibushelelezi, eliqinile, elimelana nomthelela futhi elingagugi.

(3) I-engeli enkulu yokubuka: i-engeli yokubuka ingaphezu kwamadigri angu-175, isondele kumadigri angu-180, futhi inomphumela wokukhanya odakeni ohlukanisayo ongcono wokukhanya.

(4) Amandla anamandla okukhipha ukushisa: Imikhiqizo ye-COB ifaka isibani ku-PCB, futhi idlulise ngokushesha ukushisa kwentambo yesibani ngefoyili yethusi ku-PCB.Ugqinsi lwe-foil yethusi lwebhodi le-PCB lunezidingo eziqinile zenqubo.Ngokungezwa kwenqubo yokubeka igolide, ngeke kubangele ukuncisha ukukhanya okukhulu.Ngakho-ke, kukhona izibani ezimbalwa ezifile, ezinweba kakhulu impilo yesibonisi se-LED.

(5) Ukugqoka okuqinile, ukuhlanza okulula: indawo ebushelelezi neqinile, imelana nomthelela futhi ayigugi;Ayikho imaski, futhi uthuli lungahlanzwa ngamanzi noma ngendwangu.

(6) Zonke izici zesimo sezulu ezinhle kakhulu: kwamukelwa ukwelashwa kokuvikela kathathu, okuvelele okungangenwa amanzi, umswakama, ukugqwala, uthuli, ugesi ongashintshi, i-oxidation nemiphumela ye-ultraviolet;Ingakwazi ukuhlangabezana nezimo zokusebenza zezulu laso sonke, kanye nemvelo yomehluko wokushisa ukusuka ku -30℃kuze -80℃isengasetshenziswa ngokujwayelekile.

Isingeniso se-COB Packaging Process

1. Izinzuzo ekusebenzeni kahle kokukhiqiza

Inqubo yokukhiqiza yokupakishwa kwe-COB ngokuyisisekelo iyafana naleyo ye-SMD yendabuko, futhi ukusebenza kahle kokufakwa kwe-COB ngokuyisisekelo kuyafana nokupakishwa kwe-SMD kunqubo yocingo oluqinile lwe-solder.Mayelana nokusabalalisa, ukuhlukaniswa, ukusatshalaliswa kokukhanya kanye nokupakishwa, ukusebenza kahle kokupakishwa kwe-COB kuphakeme kakhulu kunemikhiqizo ye-SMD.Izindleko zabasebenzi nezokukhiqiza ze-akhawunti yendabuko ye-SMD yokupakisha cishe i-15% yezindleko zempahla, kanti izindleko zabasebenzi nezokukhiqiza ze-COB zibiza cishe u-10% wezindleko zempahla.Ngokupakishwa kwe-COB, izindleko zabasebenzi nezokukhiqiza zingonga ngo-5%.

2. Izinzuzo zokumelana nokushisa okuphansi

Ukumelana nokushisa kwesistimu yezinhlelo zokusebenza zokupakisha ze-SMD zendabuko yilokhu: i-chip - i-crystal adhesive eqinile - i-solder joint - i-solder paste - i-foil yethusi - isendlalelo sokuvikela - i-aluminium.Ukumelana okushisayo kwesistimu yokupakisha ye-COB yile: i-chip - i-crystal adhesive eqinile - i-aluminium.Ukumelana nokushisa kwesistimu kwephakheji ye-COB kuphansi kakhulu kunaleyo yephakheji ye-SMD yendabuko, ethuthukisa kakhulu impilo ye-LED.

3. Izinzuzo zekhwalithi yokukhanya

Ekupakishweni kosiko kwe-SMD, amadivaysi amaningi ahlukene anamathiselwe ku-PCB ukuze akhe izingxenye zomthombo wokukhanya wezinhlelo zokusebenza ze-LED ngendlela yamapeshi.Le ndlela inezinkinga zokukhanya kwamabala, i-glare kanye ne-ghosting.Iphakheji ye-COB iyiphakheji ehlanganisiwe, engumthombo wokukhanya ongaphezulu.Umbono mkhulu futhi kulula ukuwulungisa, wehlisa ukulahleka kokukhanya kwe-refraction.

4. Izinzuzo zohlelo lokusebenza

Umthombo wokukhanya we-COB uqeda inqubo yokukhweza nokugeleza kabusha kwe-solder ekugcineni kwesicelo, unciphisa kakhulu inqubo yokukhiqiza nokukhiqiza ekupheleni kwesicelo, futhi ulondoloza imishini ehambisanayo.Izindleko zokukhiqiza kanye nemishini yokukhiqiza ziphansi, futhi ukusebenza kahle kokukhiqiza kuphezulu.

5. Izinzuzo zezindleko

Ngomthombo wokukhanya we-COB, izindleko zohlelo lonke lwesibani se-1600lm zingancishiswa ngo-24.44%, izindleko zohlelo lwesibani se-1800lm zingancishiswa ngo-29%, futhi izindleko zohlelo lonke lwesibani se-2000lm zingancishiswa ngo-32.37%

Ukusebenzisa umthombo wokukhanya we-COB kunezinzuzo ezinhlanu phezu kokusebenzisa umthombo wokukhanya wephakheji ye-SMD yendabuko, enezinzuzo ezinhle ekusebenzeni kahle kokukhiqiza komthombo wokukhanya, ukumelana nokushisa, ikhwalithi yokukhanya, isicelo kanye nezindleko.Izindleko eziphelele zingancishiswa cishe ngo-25%, futhi idivayisi ilula futhi isebenziseka kalula, futhi inqubo ilula.

Izinselele zamanje zobuchwepheshe ze-COB:

Njengamanje, ukuqoqwa kwemboni ye-COB nemininingwane yenqubo idinga ukuthuthukiswa, futhi iphinde ibhekane nezinkinga ezithile zobuchwepheshe.

1. Izinga lokuqala lokuphasa lokupakishwa liphansi, umehluko uphansi, futhi izindleko zokunakekela ziphezulu;

2. Umbala wayo wokunikeza ukufana kuncane kakhulu kunaleso sesikrini esingemuva kwe-SMD chip enokukhanya nokuhlukaniswa kombala.

3. Iphakethe le-COB elikhona lisasebenzisa i-chip esemthethweni, edinga inqubo yokubopha ikristalu eqinile nentambo.Ngakho-ke, kunezinkinga eziningi ohlelweni lokubopha ucingo, futhi ubunzima benqubo buhambisana ngokuphambene nendawo ye-pad.

4. Izindleko zokukhiqiza: ngenxa yezinga eliphezulu elingasebenzi kahle, izindleko zokukhiqiza ziphezulu kakhulu kunezikhala ezincane ze-SMD.

Ngokusekelwe kulezi zizathu ezingenhla, nakuba ubuchwepheshe bamanje be-COB buye benza ezinye izimpumelelo endaweni yokubonisa, akusho ukuthi ubuchwepheshe be-SMD buhoxile ngokuphelele ekwehleni.Emkhakheni lapho ukuhlukaniswa kwamaphoyinti kungaphezu kuka-1.0mm, ubuchwepheshe bokupakisha be-SMD, nokusebenza komkhiqizo wabo ovuthiwe futhi ozinzile, umkhuba obanzi wemakethe kanye nesistimu yokuqinisekisa yokufaka nokugcinwa okuphelele, kuseyindima ehamba phambili, futhi futhi iwukhetho olufaneleka kakhulu. isiqondiso kubasebenzisi kanye nemakethe.

Ngokuthuthuka kancane kancane kobuchwepheshe bomkhiqizo we-COB kanye nokuthuthuka okuqhubekayo kwesidingo semakethe, ukusetshenziswa kwezinga elikhulu kobuchwepheshe bokupakisha be-COB kuzobonisa izinzuzo zayo zobuchwepheshe kanye nenani ebangeni lika-0.5mm~1.0mm.Ukuze uboleke igama embonini, "i-COB packaging yakhelwe u-1.0mm nangaphansi".

I-MPLED ingakunikeza ngokuboniswa kwe-LED kwenqubo yokupakisha ye-COB, kanye ne-ST yethu Pro chungechunge imikhiqizo inganikeza izixazululo ezinjalo. Isikrini sokubonisa se-LED esiqedwe inqubo yokupakishwa kwe-cob sinezikhala ezincane, isithombe esicacile nesithambile kakhulu.I-chip ekhipha ukukhanya ihlanganiswe ngokuqondile ebhodini le-PCB, futhi ukushisa kusakazwa ngokuqondile ebhodini.Inani lokumelana nokushisa lincane, futhi ukuchithwa kokushisa kunamandla.Ukukhanya okungaphezulu kukhipha ukukhanya.Ukubukeka okungcono.